Our business goal is to be the most professional PCB manufacturer for prototyping and low-volume production to work with in the world.
With more than a decade in the field, we are committed to meeting the needs of our customers from different industries in terms of quality,
delivery, cost-effectiveness and any other demanding requests. As one of the most experienced PCB manufacturers and SMT Assemblers in China,
we pride ourselves to be your best business partners as well as good friends in every aspect of your PCB needs.
| One-stop PCBA | Industrial PCBA Customize Multilayer Printed Circuit Board |
| Layers | 2 - 36 L. |
| Substrate | FR-4,,CTI600,Tg180,,Anti CAF,Halogen-free,,High frequency,Tg170&HF, |
| Max. panel size | 630 mm x742 mm (Double side), 550 mm x 650 mm (Multilayer). |
| Board thickness | 0.2 mm - 4.0 mm. |
| Copper thickness | 4 oz. (inner) to 6 oz. (outer) (Max) |
| Hole | > 0.15mm. |
| Aspect Ratio | 12 : 1 |
| Min. track width | 2.5 mils(partial) |
| Min. track space | 2.5mils(partial) |
| Min. S/M bridge | 3mil |
| Hole plugging diameter | 0.3 mm~0.55 mm. |
| Impedance tolerance | +/- 10%. |
| Color of S/M | green,white,black,red,orange,yellow,blue,purple |
| Surface treatment | OSP,HAL,HAL LF,ENIG,Hard gold,Imm Ag,Imm Sn,Peelable soldermask,Carbon ink print,Selective hard gold |
| Component package | Cut Tape,Tube,Reels,Loose Parts |
PCB assembly
process | Drilling---Exposure---Plating---Etaching & Stripping---Punching---Electrical Testing---SMT---Wave Soldering---AOI test---Assembling---ICT---Function Testing---Temperature & Humidity&Aging ect. Testing |
Capability - SMT
Lines 9(5 Yamaha,4KME)
Capacity 52 million placements per month
Max Board Size 457*356mm.(18”X14”)
Min Component size 0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
Speed 0.15 sec/chip,0.7 sec/QFP
Our approach
We team up with you to make your product within the critical time path reacting fast and flexible on new insights. We follow our qualified way of making prototypes, systematically developing your idea into a prototype or device according to your requirements.
Our service
Mentor graphics lay-outing
Quality systems ISO9001, 13485
Continous improvement
DfX: design for excellence
TPD / DMR product documentation management
Supply chain management
Assembly platform: printing, pick & place and soldering
Inspection and failure analysis: 3D automated optical, X-ray
Quality control:
AOI Testing
Checks for solder paste
Checks for components down to 0201"
Checks for missing components, offset, incorrect parts, polarity
X-Ray Inspection
X-Ray provides high-resolution inspection of:
BGAs
Micro BGAs
Chip scale packages
Bare boards
In-Circuit Testing
In-Circuit Testing is commonly used in conjunction with AOI minimizing functional
defects caused by component problems.
Power-up Test
Advanced Function Test
Flash Device Programming
Functional testing
Industry PCBA application:
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